📋 Table of Contents

• About the Project
• STM32F4VE Hardware Overview
• Software & Toolchain
• Hardware Specifications
• PCB Stackup & Layer Configuration
• 3D Board Renders
• Schematic Design
• PCB Layout Views
• Design Verification
• How to Use
• Video Walkthrough
• Attribution

🔬 About the Project

🏛️ FOSSEE Autumn Internship 2026 — Screening Task

This repository contains the complete printed circuit board design and schematic files for an STM32F4VE microcontroller development board. The design was developed as part of the screening task for the FOSSEE Autumn Internship program in 2026 at IIT Bombay.

The core of this board is the high-performance STM32F407VET6 IC, providing a robust hardware platform for advanced microelectronics and circuit design applications. The board features a black solder mask to replicate standard commercial STM development boards, with custom silkscreen graphics featuring the official FOSSEE logo, the STM logo, and the designer's name.

🧠 STM32F4VE Hardware Overview

The STM32F4VE (STM32F407VET6) is a powerful, high-performance ARM Cortex-M4 core device widely used in embedded systems due to its balance of processing power, memory, and rich peripheral set.

⚙️ Core Specifications Parameter Value Processor ARM 32-bit Cortex-M4 with FPU Max Frequency 168 MHz Flash Memory 512 KB SRAM 192 KB + 4 KB backup Operating Voltage 1.8V – 3.6V Package LQFP-100

🔌 Advanced Peripherals Interface Count I2C Up to 3x SPI Up to 3x I2S Up to 2x USART / UART 4x USART + 2x UART CAN Bus 2x SDIO 1x

_{STM32F407VET6 — Reference Development Board}

🛠️ Software & Toolchain

Schematic Design

PCB Layout

3D Models / Symbols / Footprints

Manufacturing Rules

📌 Note: Schematic design was done in eSim 2.5, with PCB layout handled by KiCad 6 (integrated via eSim). All component libraries — 3D models, schematic symbols, and footprints — were sourced from SnapEDA.

⚡ Hardware Specifications & Features

🔧 Key Features at a Glance

🎛️ Board Features Feature Description Microcontroller STM32F407VET6 high-speed MCU Power Management 3.3V power routing with CR12 backup battery Connectivity Micro USB port, SD Card reader Headers Extensive connector headers for GPIO access Timing Onboard oscillators for accurate clocking User Interface Integrated switches and status LEDs

🏭 Manufacturing Specs Parameter Value Layer Count 4-Layer PCB Manufacturer JLCPCB (base model rules) Solder Mask Black (commercial-grade) Silkscreen Custom graphics (FOSSEE + STM logos) ERC Status ✅ Passed (0 errors) DRC Status ✅ Passed (0 errors)

🧱 PCB Stackup & Layer Configuration

The board is routed as a 4-layer PCB, specifically configured to comply with JLCPCB base model manufacturing rules.

Layer	Name	Function
🔴 Layer 1	Front (F.Cu)	Signal routing and ground pour
🟡 Layer 2	Inner 1 (In1.Cu)	Dedicated ground plane
🟢 Layer 3	Inner 2 (In2.Cu)	Dedicated 3.3V power plane
🔵 Layer 4	Back (B.Cu)	Ground plane

📐 Layer 1 — Front Copper	📐 Layer 2 — Inner Ground Plane
📐 Layer 3 — Inner Power Plane (3.3V)	📐 Layer 4 — Back Copper

🔍 Click to view individual PCB layer renders

Front Layer PCB	Back Layer PCB
Inner Layer 1 (In1.Cu)	Inner Layer 2 (In2.Cu)

All Layers Combined

All ICs Highlighted

🖼️ 3D Board Renders

🔝 Front View — 3D Render	🔽 Back View — 3D Render
📐 Side View — 3D Render	📐 Side Down View — 3D Render

🔍 Click to view additional 3D renders

3D Model Overview	Front — IC Close-up
Components Only View	PCB — Components Only (Alt)

📐 Schematic Design

_{Full Schematic Overview — eSim 2.5}

🔍 Click to view schematic sections

Schematic — Section 1

Schematic — Section 2

🔧 PCB Layout Views

📋 PCB — All Layers

📋 JLCPCB Gerber Preview

✅ Design Verification

🔋 ERC — Electrical Rules Check

📏 DRC — Design Rules Check

✅ Electrical Rules Check (ERC): Passed with zero errors. Wire labels were utilized for power nets instead of standard power flags.

✅ Design Rules Check (DRC): Passed with zero errors, ensuring complete manufacturability compliance with JLCPCB specifications.

🔍 Click to view additional verification results

DRC — PCB View

Excluded ERC Warnings

📦 How to Use This Repository

1.  Download the project repository and extract the files.
2.  Open the schematic files using eSim 2.5 to view circuit connections.
3.  Open the PCB layout files in KiCad 6 to inspect:
      • Routing and trace widths
      • Layer stackup configuration
      • 3D model and component placement
4.  Generate Gerber files directly from KiCad for fabrication
    at any standard PCB manufacturer (JLCPCB recommended).

💡 Tip: All component libraries (3D models, symbols, footprints) are sourced from SnapEDA and should be imported into your KiCad library manager before editing.

🎬 Video Walkthrough

_{📹 Click to watch the complete project walkthrough on YouTube}

🏷️ Attribution

Program Host

PCB Design & Schematics

Component Sources

_{⭐ Star this repo if you found it useful! ⭐}